The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 06, 2003

Filed:

Jun. 28, 2000
Applicant:
Inventors:

Akihiro Kato, Yokohama, JP;

Shozo Kinoshita, Fuji, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 2/704 ; B32B 1/508 ;
U.S. Cl.
CPC ...
B32B 2/704 ; B32B 1/508 ;
Abstract

Disclosed are a curable polyphenylene ether (PPE) resin composition comprising (a) a PPE resin and (b) a of a compound having a 3,4-dihydro-3-substituted-1,3-benzoxazine skeleton (DSBS compound), or a mixture of the DSBS compound and a ring-opening polymerization re-action product thereof; a cured PPE resin composition obtainable by curing the curable PPE resin composition; and a laminate structure obtained by using the curable or cured PPE resin composition. The curable PPE resin composition exhibits, after cured, excellent chemical resistance, moisture resistance, dielectric characteristics, heat resistance, flame retardancy and dimensional stability, so that it can be used as a dielectric, insulating or heat resistant material in the electrical, electronic, space and aircraft industries. Especially, it can be advantageously used as a resin composition for forming insulating layers, such as substrates for a single-sided, double-sided or multi-layer printed circuit board, a flexible printed circuit board and a semi-rigid circuit board, and a substrate for a structure having excellent heat removal characteristics.


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Kato, Akihiro. (2003). Thermosetting polyphenylene ether resin composition, cured resin composition obtained therefrom, and laminated structure (U.S. Patent No. 6558783). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6558783

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