The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 06, 2003

Filed:

Mar. 29, 1999
Applicant:
Inventors:

Craig Bienick, Jenison, MI (US);

Bob Herrmann, Spring Lake, MI (US);

Howard Daley, Zeeland, MI (US);

Assignee:

Gemtron Corporation, Sweetwater, TN (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 4/320 ;
U.S. Cl.
CPC ...
B29C 4/320 ;
Abstract

A peripherally encapsulated product, such as an oven door outer shell, is molded in accordance with this invention by placing a piece of glass between mold clamping portions of relatively movable closed bodies when the latter are in an open position. Preferably both bodies are heated and thermosetting polymeric material (SMC or BMC) is placed upon selected areas of one of the mold bodies within and about an area corresponding to an annular mold cavity and outboard of a peripheral edge of a piece of glass. The glass is clamped between mold clamping portions of the mold bodies which are then progressively closed creating compression forces which extrude the thermosetting polymeric material into the annular cavity and into complete encapsulation of the continuous peripheral edge of the piece of glass. The thermosetting polymeric material is cured, the mold bodies are opened and the product is removed therefrom. The encapsulated product can be provided with post-formed vent openings and/or handle attaching openings or the handle can be integrally molded during the molding process.


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