The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2003
Filed:
Jan. 25, 2001
Applicant:
Inventors:
Minoru Kouda, Hirakata, JP;
Shigeharu Hattori, Nara, JP;
Saburo Nakatsuka, Kyoto, JP;
Hiroshi Takebayashi, Hirakata, JP;
Toshio Sanukiya, Katano, JP;
Assignee:
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 4/302 ; B29C 4/350 ;
U.S. Cl.
CPC ...
B29C 4/302 ; B29C 4/350 ;
Abstract
Powder mixture is supplied into a die under a state that a center pin is located lower than the top surface of the die, after which the center pin is lifted up to a given molding position where an annular molding space is defined between the center pin and the die. The powder mixture is then compressed from upper and lower sides with an upper plunger and a lower plunger to form a pellet. The center pin and the lower plunger are simultaneously lifted up to remove the pellet out of the die.