The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2003
Filed:
May. 25, 2001
Christophe Bagnoud, Veyras, CH;
Miroslaw Plata, Vetroz, CH;
Jurgen Wust, Erding, DE;
Klaus Wahrisch, Pliening, DE;
Alcan Technology & Management Ltd., Neuhausen am Rheinfall, CH;
Abstract
A method for process monitoring during die casting or vacuum thixoforming of metals in a mold, wherein the time lapse of temperature (T) is continuously measured on at least one point of the system and the temperature progression of the system is calculated in real time using a program. The time lapse of the heat flow (W) is calculated from the temperature progression of the system and the time lapse of the energy (U) of the system and the solidification heat portion (U ) of the metal solidified in the mold are calculated from the heat flow. At a given time, the calculated values are used as monitoring parameters.