The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2003
Filed:
May. 16, 2001
Yasuaki Nakamura, Odawara, JP;
Masayuki Sakurai, Tokyo, JP;
Kazumitsu Ishikawa, Odawara, JP;
Hiroyuki Kudoh, Odawara, JP;
Hitachi AIC, Inc., Tokyo, JP;
Abstract
A printed wiring board ( ) having a cavity ( ) for mounting electronic parts therein and a method for manufacturing thereof, comprising: an upper wiring substrate ( A) having flat surfaces on both sides; a lower plate body ( B) being fixed on a reverse side surface of the upper wiring substrate, and being formed with the cavity ( ) in a part thereof, for receiving an electronic part ( ) within an inside thereof; conductor layers ( ) provided on both side surfaces of the upper wiring substrate for mounting electronic parts thereon, by forming plated through-holes ( ) or flat through-holes ( ′), in particular with in a region of the cavity on the reverse side surface thereof; and external electrodes ( ) formed on side-end surface or on a lower-end surface of the printed wiring board, wherein at least an electronic part, for example, hybrid IC, chip-like parts, functional parts, such as SAW filter, sensor parts, etc., can be received or stored within a space of the cavity ( ), thereby enabling the mounting of the electronic parts thereon with high density and reliability, such as on a motherboard ( ).