The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2003
Filed:
Jun. 29, 2001
Jong-hyon Ahn, Kyungki-do, KR;
Chang-hun Lee, Kyungki-do, KR;
Samsung Electronics Co., Ltd., Suwon, KR;
Abstract
A semiconductor device has a stress reducing laminate. Grooves are formed on the surface of a material layer selected from a multilayer structure of the semiconductor device, for example, a conductive layer. The cross sections of the grooves are semicircular or semi-elliptic. The stress applied to the conductive layer having the grooves is divided into a vertical component and a horizontal component with respect to the surface of the conductive layer. Accordingly, the stress applied vertically to the conductive layer is reduced, making it is possible to prevent the conductive layer from cracking due to stress and to reduce the stress transmitted to material layers under the conductive layer.