The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2003
Filed:
Oct. 29, 2001
Takashi Yamaji, Tokyo, JP;
Mamoru Komatsu, Tokyo, JP;
Sumitomo Bakelite Company Limited, Tokyo, JP;
Abstract
A process for manufacturing a prepreg exhibiting excellent formability and producing laminated boards and multiple layer circuit boards exhibiting high thickness precision is disclosed. The process of manufacturing the prepreg comprises (a) a step of impregnating a glass fiber substrate with a solvent, (b) a step of impregnating the solvent-impregnated glass fiber substrate with epoxy resin, (c) a step of heating the epoxy resin-impregnated glass fiber substrate, (d) a step of further impregnating the epoxy resin-impregnated glass fiber substrate, in which the epoxy resin has been cured, with the epoxy resin, and (e) a step of heating the lastly obtained epoxy resin-impregnated glass fiber substrate, wherein the epoxy resin reaction rate in the inner layer is 85% or more and the epoxy resin reaction rate in the outer layer is 60% or less.