The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2003
Filed:
Jun. 19, 2000
A.K. Technical Laboratory, Inc., Nagano, JP;
Abstract
A required preform is molded by rapidly cooling molten resin which has been injected and filled into an injection mold. The preform is held by its neck portion with a neck mold and is mold-released in a high temperature state. A bottle having a thin body portion is molded by stretch blowing laterally and longitudinally within a blow mold. Among the thickness and length of a stretched portion of the preform which are set according to the volume and weight and body portion thickness of the bottle , the thickness is set to be thinner than the usually set thickness. The length is set to be long inversely proportional to the thickness setting. The preform is mold-released at a higher temperature than usual and is stretch-blow molded before its outer surface temperature reaches its peak. By reducing the thickness of the stretched portion of the preform and, on the contrary, increasing the length thereof, it is possible to stretch blow mold a hollow molded product with a usual geometry in which the body portion thickness is below 0.2 mm, even in a hot parison method which carries out mold-release at high temperature.