The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2003
Filed:
Feb. 18, 2000
Katsumasa Miki, Osaka, JP;
Masaya Nakatani, Hyogo, JP;
Isaku Kanno, Nara, JP;
Ryoichi Takayama, Osaka, JP;
Koji Nomura, Osaka, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A fluid ejection device, such as for an ink jet printer or the like, having increased increasing nozzle density. A through-hole ( ) is provided in a glass substrate ( ) to which a second silicon substrate ( ) is directly bonded to form an ink outlet ( ). The first silicon substrate ( ) is etched to form a pressure chamber ( ), an ink channel ( ) and an ink inlet ( ), and bonded directly to the glass substrate ( ). A piezoelectric thin film ( ), having a conductive, elastic body ( ), is bonded to the first substrate covering the pressure chamber ( ). The elastic body ( ) is sandwiched between the piezoelectric thin film ( ) and a resin layer ( ). The second substrate ( ) has a thickness of less than about 0.8 mm in a range of thickness comprising about 1.2 to about 1.9 times (rg-rs), wherein rg is the diameter of the wide end of the through-hole ( ) and rs is the diameter of the narrow end of the through-hole ( ).