The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2003

Filed:

Mar. 30, 2001
Applicant:
Inventors:

Kenichi Ohno, Tokyo, JP;

Torahiko Kanda, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/16 ;
U.S. Cl.
CPC ...
B41J 2/16 ;
Abstract

To suppress adhesive extrusion in an ink flow path and irregularities or air bubbles (void) in the adhesive layer, thus enabling to improve reliability and yield as well as reduce the production cost. An ink jet printing head comprising a plurality of substrates having a hole or groove which are attached to one another via an adhesive layer, wherein thickness of adhesive is adjusted according to a thinner substrate as a reference of two substrates to be attached to each other in such a way that the thickness of the adhesive becomes thinner as the reference substrate becomes thinner and thicker as the reference substrate becomes thicker.


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