The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2003
Filed:
Dec. 08, 2000
Terry E. Burnette, New Braunfels, TX (US);
Thomas H. Koschmieder, Austin, TX (US);
Andrew J. Mawer, Austin, TX (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A semiconductor device ( ) includes a semiconductor die ( ) having electronic circuitry that is connected to a substrate ( ). The substrate ( ) is used to interface the semiconductor die ( ) to a printed circuit board ( ). The substrate ( ) includes a plurality of bonding pads ( ). A first portion of the plurality of bonding pads are soldermask defined (SMD) bonding pads ( ) and a second portion of the plurality of bonding pads are non-soldermask defined (NSMD) bonding pads ( ). Using a combination of SMD and NSMD bonding pads provides the advantages of good thermal cycling reliability and good bending reliability over devices that have only SMD bonding pads or NSMD bonding pads.