The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2003
Filed:
Feb. 15, 2001
Young-Jae Song, Cheonan, KR;
Young-Shin Kwon, Cheonan, KR;
Kun-Dae Youm, Asan, KR;
Young-Soo Kim, Seoul, KR;
Samsung Electronics Co., Ltd., Suwon, KR;
Abstract
A high-density memory card comprises a base card and two packages fixedly mounted within the base card. The two packages are attached to the base card and face each other. In one embodiment, a first package comprises a first substrate and at least one memory chip, and a second package comprises a second substrate and at least one memory chip. A first surface of the first substrate has external connection pads formed thereon and is exposed from the memory card. A second surface of the first substrate has first connection pads formed thereon. The memory chips are mounted on the second surface and electrically connected to each other. A third surface of the second substrate is exposed from the memory card, and a fourth surface of the second substrate has second connection pads formed thereon. The memory chips are mounted on the fourth surface and electrically connected to each other. The base card further includes internal connection means, and the first and the second connection pads are electrically connected to the internal connection means. The external connection pads provide electrical connection between said internal connection means to an external system. By connecting two packages to the base card, the memory card of the present invention can increase the memory density of the smart cart four times or more. Also, the problems encountered in the conventional smart card manufacturing process or the test process due to the use of plural memory chips can be prevented.