The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2003
Filed:
Aug. 08, 2000
Applicant:
Inventors:
Mieko Suzuki, Tokyo, JP;
Akira Kubo, Tokyo, JP;
Assignee:
NEC Electronics Corporation, , JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract
A semiconductor device in which an interconnection material is buried in a hole formed in an interlevel insulating film arranged on a semiconductor substrate includes a protective layer formed on the surface of the interlevel insulating film that has a lower polishing rate than that of the interconnection material in chemical mechanical polishing. A method of manufacturing this semiconductor device is also disclosed.