The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2003
Filed:
Apr. 26, 2001
Torkel Amborg, Stockholm, SE;
Ulf Smith, Huddinge, SE;
Telefonaktiebolaget LM Ericsson (publ), Stockholm, SE;
Abstract
On a semiconductor die, a conductive layer is formed by first attaching a semiconductor wafer to a support wafer, then cutting the semiconductor wafer into dies, and finally depositing a conductive layer on the sides of the dies. The conductive layer is preferably a metal layer, which extends into the support wafer, which ensures that, when the support wafer is removed, the conductive layer extends all the way over the sidewall of the semiconductor die. The method allows the simultaneous application of the conductive layer to many dies. The conductive layer reduces the resistance for currents in the radio frequency range flowing close to the edges of the die due to the skin effect.