The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2003
Filed:
Nov. 09, 2000
Applicant:
Inventors:
Alain R. Carre, Le Chatelet-en-Brie, FR;
Jurriaan Gerretsen, Samois-sur-Seine, FR;
Assignee:
Corning Incorporated, Corning, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 5/12 ; B23K 3/102 ;
U.S. Cl.
CPC ...
B05D 5/12 ; B23K 3/102 ;
Abstract
A process for fabricating a solder bump ( ) includes providing an inorganic de-wetting substrate ( ). In order to form a composite substrate ( ), having the desired wetting/dewetting composition, a wetting metal is first applied on the inorganic de-wetting substrate to create at least one wetting metal pad ( ). The composite substrate ( ) is then dipped or otherwise immersed into a reservoir of liquid solder ( ). Next, the composite substrate ( ) is redrawn ( ), or otherwise removed, from the liquid solder to form solder bumps ( ) on the at least one metal wetting pad ( ).