The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2003
Filed:
Mar. 02, 2001
Applicant:
Inventors:
Yan Xiong, Bradenton, FL (US);
Cullen M. Sabin, Cortez, FL (US);
Assignee:
Tempra Technology Inc., Bradenton, FL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65B 3/104 ;
U.S. Cl.
CPC ...
B65B 3/104 ;
Abstract
Vacuum packaging methods and materials are claimed. The materials are fusible and can form a part of a heat seal closure for non-rigid and semi-rigid packages. The methods are suitable for packages containing materials generally, and are well suited for those containing granular materials.
Xiong, Yan. (2003). Evacuatable, heat sealable package and method of using the same (U.S. Patent No. 6550223). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6550223
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile