The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6549404 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 15, 2003

Filed:

Feb. 14, 2001
Applicant:
Inventors:

Takashi Kitahara, Matsuda-machi, JP;

Naoki Shuto, Machida, JP;

Assignee:

PFU Limited, Ishikawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 ;
U.S. Cl.
CPC ...
H05K 7/20 ;
Abstract

A semiconductor module apparatus is configured such that the upper surface of a substrate on which are mounted a plurality of heat-generating semiconductor devices is covered with a radiation plate serving as a support frame for supporting the substrate. A plurality of radiation fins are protruding from the radiation plate. A cover plate is fixedly attached to the radiation plate in such a manner as to cover the radiation plate from above so as to define an air channel for cooling air therebetween. A cooling fan unit is fixedly disposed within the air channel.


Find Patent Forward Citations

Kitahara, Takashi. (2003). Semiconductor module apparatus and cooling apparatus (U.S. Patent No. 6549404). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6549404

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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