The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2003
Filed:
Jan. 08, 2002
Yoshio Saito, Westchester, CA (US);
TRW Inc., Redondo Beach, CA (US);
Abstract
Disclosed are a packaging component for packaging a microelectronic (e.g., III-V semiconductor) device, the packaged microelectronic device, and methods for manufacture thereof. The component has sequentially deposited layers of metal ( ), to be located within the package, to act as a hydrogen getter. The sequentially deposited layers of metal include at least a first layer ( ) of Ni adjacent the housing member surface, to improve adherence of the sequentially deposited layers and interstitially trap hydrogen; an outermost layer ( ) of palladium to convert molecular hydrogen to hydrogen atoms and to absorb hydrogen; and a layer ( ) of Ti or Zr adjacent this outermost layer. Additional layers ( ) of nickel and of titanium or zirconium can be provided between the first layer and the layer adjacent the outermost layer. Desirably, the surface of the housing member is roughened prior to depositing the first layer thereon.