The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2003
Filed:
Oct. 25, 2001
Applicant:
Inventor:
Masaaki Irie, Tokyo, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/358 ; H01L 2/3544 ;
U.S. Cl.
CPC ...
H01L 2/358 ; H01L 2/3544 ;
Abstract
A semiconductor apparatus includes a wiring substrate and a semiconductor device to be mounted at a proper mounting position on the wiring substrate. The wiring substrate has two contact terminals in electrical contact with each other. The semiconductor device has two contact terminals in electrical contact with each other and two detection-utility terminals respectively in electrical contact with the contact terminals of the semiconductor device. The contact terminals of the wiring substrate are located at positions so that they come in electrical contact with the corresponding contacts of the semiconductor device.