The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 15, 2003

Filed:

Sep. 27, 2000
Applicant:
Inventors:

Noriaki Sakamoto, Gunma, JP;

Yoshiyuki Kobayashi, Gunma, JP;

Junji Sakamoto, Gunma, JP;

Shigeaki Mashimo, Gunma, JP;

Katsumi Okawa, Gunma, JP;

Eiju Maehara, Gunma, JP;

Kouji Takahashi, Gunma, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ; H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ; H01L 2/348 ;
Abstract

After a trench is formed in a conductive foil , the circuit elements are mounted, and the insulating resin is applied on the conductive foil as the support substrate. After being inverted, the conductive foil is polished on the insulating resin as the support substrate for separation into the conductive paths. Accordingly, it is possible to fabricate the circuit device in which the conductive paths and the circuit elements are supported by the insulating resin , without the use of the support substrate. And the interconnects L to L requisite for the circuit are formed, and can be prevented from slipping because of the curved structure and a visor


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