The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 15, 2003

Filed:

Mar. 07, 2000
Applicant:
Inventors:

Ted T. Chen, Saratoga, CA (US);

Michael P. Skinner, San Jose, CA (US);

Assignee:

Kulicke & Soffa Holdings, Inc., Willow Grove, PA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03F 9/00 ;
U.S. Cl.
CPC ...
G03F 9/00 ;
Abstract

A dielectric layer in a wiring substrate having a sloped sidewall. A photomask used to pattern the dielectric layer includes optical proximity features. The size and spacing of the optical proximity features are generally less than the resolution limit of the exposure tool used and do not print out on the layer. The optical proximity features provide a transition region between fully exposed material and un-exposed material, which results in a sloped sidewall of the photo-sensitive material after development. The sloped sidewall provides a more reliable thin film metal layer to contact through vias, and may be used to conserve wiring board area by allowing smaller via spacing.


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