The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2003
Filed:
Oct. 24, 2001
Takayuki Nagai, Tokyo, JP;
Yoshio Kubo, Tokyo, JP;
Kunihiko Egawa, Tokyo, JP;
Osamu Taguchi, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A method for manufacturing a Sn-based alloy containing a finely dispersed Sn—Ti compound includes melting Sn by heating to a temperature in a range from 1300 to 1500° C. in vacuum or an inert gas atmosphere, adding 0.1 to 5% by weight of Ti followed by melting by heating, and casting the molten alloy into a copper mold directly or through a pouring cup. The Sn-based alloy obtained by this method contains the Sn—Ti compound having a maximum particle diameter of 30 &mgr;m and a mean particle diameter of 5 to 20 &mgr;m. A precursor of a Nb Sn wire is also obtained by an inner diffusion method using this Sn-based alloy. The Nb Sn wire manufactured by using the Sn-based alloy of the present invention exhibits excellent superconductive characteristics. The method of the present invention enables the ingot to be free from a shrinkage cavity appearing during prior art manufacturing processes.