The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2003
Filed:
Jun. 14, 2001
Applicant:
Inventors:
Tushar T. Shah, Columbia, MD (US);
Andrew TS Pomerene, Leesburg, VA (US);
Keith K. Sturcken, Nokesville, VA (US);
Steven J. Wright, Fredericksburg, VA (US);
Assignee:
Bae Systems Information and Electronic Systems Integration Inc., Nashua, NH (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 3/512 ; B23K 3/102 ;
U.S. Cl.
CPC ...
B23K 3/512 ; B23K 3/102 ;
Abstract
A method of forming a plurality of micro column interconnection structures on a semiconductor includes providing a semiconductor layer. A photoresist layer is formed on the semiconductor layer. A plurality of cavities are etched in the photoresist layer. The plurality of cavities extend through the photoresist layer to the semiconductor layer. Solder is deposited in the plurality of cavities, thereby forming a plurality of micro columns of solder.