The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2003
Filed:
Aug. 16, 1999
Toru Aoki, Shiga, JP;
NEC Machinery Corporation, Kusatsu, JP;
Abstract
A die bonder, to which semiconductor pellets are supplied in an arranged state, comprises a substrate feeding mechanism for feeding a substrate including a plurality of pellet islands to successively set the pellet island at a bonding position BP, a defective substrate detecting means for detecting defective pellet island, and a pellet transfer mechanism. The pellet transfer mechanism successively picks up and carries a defective pellet to the bonding position BP for mounting when a pellet island of the substrate set at the bonding position is non-defective, and mounts a defective pellet when a pellet island is defective. In this arrangement, when the defective substrate detecting means determines that a pellet island is defective, a defective pellet is mounted.