The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2003
Filed:
Mar. 16, 2001
Noriaki Sakamoto, Gunma, JP;
Yoshiyuki Kobayashi, Gunma, JP;
Junji Sakamoto, Gunma, JP;
Shigeaki Mashimo, Gunma, JP;
Katsumi Okawa, Gunma, JP;
Eiju Maehara, Gunma, JP;
Kouji Takahashi, Gunma, JP;
Hirokazu Fukuda, Gunma, JP;
Hiroki Etou, Gunma, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Abstract
After a trench is formed in a conductive foil , a circuit element is mounted in a flip chip method. Then, an insulating resin is covered on the conductive foil as a support substrate. After reversion, the conductive foil is polished over the insulating resin as a support substrate at this time to separate the conductive paths. Accordingly, a circuit device having the conductive paths and the circuit elements supported by the insulating resin can be produced without employing the support substrate.