The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2003
Filed:
Aug. 22, 2002
Tushar T. Shah, Columbia, MD (US);
Keith K. Sturcken, Nokesville, VA (US);
Steven Wright, Fredericksburg, VA (US);
Abstract
Methods for manufacturing microchips are provided. A plurality of alternating metallic wiring-layers and non-metallic layers, terminating with a metallic wiring-layer, are formed on a wafer. A plurality of vias is formed for electrically interconnecting various metallic wiring-layers. A plurality of electrically conducting pads is formed adjacent various vias. A passivation layer is formed adjacent the terminal metallic wiring-layer and the plurality of conducting pads. A portion of the passivation layer is removed to expose the plurality of conducting pads. A layer is formed adjacent the passivation layer and the plurality of exposed conducting pads for protecting the microchip against electromagnetic radiation. A portion of the protective layer is removed to expose the plurality of conducting pads. Each conducting pad is electrically isolated from the protective layer. An electrically conducting bump is formed on each conducting pad.