The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2003
Filed:
Sep. 10, 2001
Applicant:
Inventors:
Paul J. Fischer, Eau Claire, WI (US);
Joseph E. Korleski, Newark, DE (US);
Assignee:
Gore Enterprise Holdings, Inc., Newark, DE (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/26 ;
U.S. Cl.
CPC ...
B32B 3/26 ;
Abstract
An electronic chip package is provided having a laminated substrate. The laminated substrate includes at least one conductive layer and at least one dielectric layer which is bonded to the conductive layer. The dielectric layer has a glass transition temperature T greater than 200° C. and a volumetric coefficient of thermal expansion of ≦75 ppm/° C. A semiconductor device is electrically attached to the laminated substrate.