The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2003

Filed:

Nov. 24, 1999
Applicant:
Inventors:

Shinzo Yasuda, Ushiku, JP;

Masaharu Mukouyama, Ibaraki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29B 7/00 ;
U.S. Cl.
CPC ...
B29B 7/00 ;
Abstract

A method capable of molding by a simple procedure such a polymer as a polysuccinimide based (co)polymer or a protein whose glass transition temperature is very close to the decomposition temperature is provided. The method for the molding of a polymer contemplated by this invention comprises heating and melting a polymer whose glass transition temperature is very close to the decomposition temperature in the presence of a solvent having a low boiling point and a high dielectric constant ratio and then molding the resultant molten product.


Find Patent Forward Citations

Yasuda, Shinzo. (2003). Method for molding of polymer (U.S. Patent No. 6544464). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6544464

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…