The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2003
Filed:
Aug. 03, 2001
Junya Akasaka, Kanagawa, JP;
Tyco Electronics, AMP, K.K., , JP;
Abstract
The present invention relates to a BGA package IC socket that accommodates a BGA (ball grid array) package such that the BGA package IC socket has high reliability and can withstand long-term use. The socket is equipped with package receiving members . Package receiving parts of members receive the portions of the BGA package located in the vicinity of the opposite edges of the undersurface of the BGA package . The parts pivot downward with the insertion of the BGA package . The parts have a shaft which are supported on the housing so that the package receiving members are free to pivot. Springs cooperate with the members , such that the springs resist the insertion of the BGA package into the socket.