The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2003
Filed:
Dec. 20, 1999
Eiji Muramatsu, Toyoshina-machi, JP;
Kogo Endo, Chino, JP;
Seiko Epson Corporation, , JP;
Abstract
A FPC board is manufactured by patterning copper foils which are bonded onto both sides of a base film having insulation and flexibility without an adhesive layer, and forming an input wiring and an output wiring on a mounting surface of an electronic component while forming a dummy wiring layer on the surface opposite the mounting surface. A dummy wiring layer is set to be slightly larger than an area where an IC chip is mounted, and has moisture resistance and light shielding properties. An input electrode of the IC chip is electrically connected to the input wiring and an output electrode 450 is electrically connected to the output wiring through electrically conductive particles dispersed into an adhesive agent , such as an epoxy resin, at an appropriate ratio, and the adhesive agent encapsulates the connection regions.