The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2003
Filed:
Nov. 30, 1999
Applicant:
Inventor:
Kenji Uchiyama, Hotaka-machi, JP;
Assignee:
Seiko Epson Corporation, , JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02F 1/1345 ;
U.S. Cl.
CPC ...
G02F 1/1345 ;
Abstract
A compression-bond-connection substrate compression-bonded to a compression-bonding target object has front-side terminals conductively connected to opposing-side terminals and backside terminals formed at the backsides thereof. The backside terminals are formed diagonally to the front-side terminals. Pressure is exerted uniformly on substrate-side terminals in the pressure application in compression-bonding. Therefore, a highly reliable compression-bonding connected assembly can be stably obtained.