The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2003
Filed:
Feb. 23, 2001
Yoshinori Uzuka, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A printed board unit includes a printed board including lands thereon, a semiconductor device unit, and an attachment mechanism to attach the semiconductor device unit to the printed board. The semiconductor device unit includes a heat transfer member, a semiconductor device including first and second surfaces parallel to each other, the first surface having lands thereon, and a socket including contacts protruding from first and second surfaces of the socket, the first and second surfaces being parallel to each other. In the semiconductor device unit, the semiconductor device and the socket are attached to the heat transfer member so that the second surface of the semiconductor device opposes the heat transfer member. The lands of the semiconductor device are electrically connected to the lands of the printed board unit via the contacts of the socket.