The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2003
Filed:
Jul. 20, 2001
Yasushi Sasaki, Yotsukaido, JP;
Shogo Tani, Narashino, JP;
Yoshihiro Uchino, Funabashi, JP;
Kiyotaka Tomiyama, Funabashi, JP;
Yutaka Maeno, Yotsukaido, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
In a semiconductor device, a lead frame is adhered to a base substrate for heat dissipation via an insulating layer, and an outward guided terminal portion is formed by perpendicularly upwardly bending an end of the lead frame after the mounting of one or more of power semiconductor elements on the lead frame. A recessed portion is formed beforehand in a portion of the lead frame to be bent, and it is ensured that the lead frame does not adhere to the surface of the base substrate in this recessed portion when the lead frame is adhered to the base substrate via the insulating layer before the bending of the lead frame. By virtue of this structure, manufacturing is simplified and manufacturing costs are reduced.