The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2003
Filed:
Dec. 04, 2001
Ellen M. Gately, Merrimack, NH (US);
Robert A. McGrath, Londonderry, NH (US);
Mark W. Gailus, Somerville, MA (US);
Teradyhe, Inc., Boston, MA (US);
Abstract
A multi-layer printed circuit board includes a via having a conductive upper portion, a conductive lower portion, and an electrically insulating intermediate portion between the upper and lower portions. In one embodiment, the insulating intermediate portion of the via is provided by a non-platable layer of the circuit board, as may be comprised of PTFE. Vias having a continuous conductive coating may be formed through clearance holes in the non-platable layer which are provided with a platable inner surface, either by filling the hole with a platable material, such as epoxy resin, prior to laminating the board or by chemically conditioning the non-platable material to make it platable. In a further embodiment, the as insulating intermediate portion of the via has a narrower diameter than the conductive upper and lower portions.