The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2003
Filed:
Nov. 16, 2001
Applicant:
Inventors:
Jeffrey L. Deeney, Fort Collins, CO (US);
David W. Mayer, Fort Collins, CO (US);
Assignee:
Hewlett-Packard Company, Palo Alto, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 ;
U.S. Cl.
CPC ...
H05K 1/03 ;
Abstract
A column grid array integrated circuit package has a substrate. The substrate has a solder column array having a plurality of solder columns and a plurality of rigid columns interspersed with the solder columns at no-connect locations. The rigid columns contact a circuit board to which the column grid array integrated circuit package is mounted and support the column grid array integrated circuit package against compressive force.