The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2003
Filed:
Feb. 13, 2002
Donald Franklin Foust, Glenville, NY (US);
William Francis Nealon, Glenville, NY (US);
Lockheed Martin Corporation, Bethesda, MD (US);
Abstract
Components or solid-state chips having electrical contacts containing copper are laminated to Kapton dielectric film, and through vias are formed down to copper-containing material of the component. A fabrication method is described for making reliable connections to the copper-containing materials. The method includes precoating the copper-containing material with SPIE, together with at least argon plasma cleaning, and possibly fluorine plasma etching, of the vias and copper material exposed at the bottoms of the vias.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile