The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 01, 2003

Filed:

Feb. 27, 2001
Applicant:
Inventors:

Kazunao Kubotera, Delmar, NY (US);

Nirajkumar Patel, Delmar, NY (US);

Assignee:

General Electric Company, Pittsfield, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/24 ; C04B 3/552 ; B28B 1/24 ;
U.S. Cl.
CPC ...
H01B 1/24 ; C04B 3/552 ; B28B 1/24 ;
Abstract

Carbon fiber-filled, thermoplastic resin compositions having improved electrical properties at a given level of carbon fibers are formed from thermoplastic resin and carbon fibers associated into bundles with a binder. The thermoplastic resin and the binder are selected to be incompatible such that the adhesion of the fiber to the resin is poor. An exemplary composition is formed from a thermoplastic polymer selected from among polystyrene, high impact polystyrene, polycarbonate, polybutylene terephthalate, polyethylene terephthalate, polyphenylene ether, polyether imide and blends thereof; and carbon fibers associated into bundles with a polyamide terpolymer binder. The bundles are dispersed within the thermoplastic polymer. The compositions can be used for injection molding of articles for use as components in applications requiring static dissipation and/or EMI shielding. Such articles include electronic devices, dust handling equipment and notebook computer enclosures.


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