The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 2003

Filed:

Apr. 15, 2002
Applicant:
Inventors:

Eitaro Kameda, Toyama, JP;

Toshiyuki Baba, Moriyama, JP;

Hideaki Kuroda, Toyama-ken, JP;

Yasuhiro Morimoto, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/02 ; H05K 1/02 ; H01L 4/104 ;
U.S. Cl.
CPC ...
H05K 7/02 ; H05K 1/02 ; H01L 4/104 ;
Abstract

A surface mount type electronic component includes a substantially rectangular case substrate, an electronic element mounted on the case substrate along the longitudinal direction, and a cap which is fixed onto the case substrate in such a manner as to cover the electronic element. First and second top-surface electrodes and first and second bottom-surface electrodes, which extend along the width direction of the case substrate, are arranged with a spacing on the top surface and the bottom surface of the case substrate, respectively. The first top-surface electrode and the first bottom-surface electrode are connected to each other via a first side electrode disposed on the side surface of the case substrate, and the second top-surface electrode and the second bottom-surface electrode are connected to each other via a second side electrode disposed on the side surface of the case substrate.


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