The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2003
Filed:
Oct. 04, 2001
Sharp Kabushiki Kaisha, Osaka, JP;
Abstract
In a semiconductor device, a second wiring layer is formed via an inter-layer insulation film on a first wiring layer connected to an active region of a silicon substrate , and a bonding pad is placed on the second wiring layer via a protection film and a polyimide film , so as to overlie the active region of the silicon substrate . The second wiring layer has a plurality of wires and in a region underlying the bonding pad : the wire is joined to the bonding pad via opening sections and provided in the protection film and the polyimide film , respectively, and the protection film and the polyimide film are placed between the wires and the bonding pad . This structure can provide a semiconductor device having multiple wiring layers and a bonding pad located at a position overlying an active region of a semiconductor substrate, which can simplify a manufacturing process and reduce a device size, and enhances the flexibility in providing the wiring between semiconductor elements and in the location of the bonding pad, and a manufacturing method of such a semiconductor device.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile