The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2003
Filed:
Mar. 28, 2000
Applicant:
Inventor:
Koji Miyata, Yao, JP;
Assignee:
Sharp Kabushiki Kaisha, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/3053 ; H01L 2/312 ; H01L 2/314 ;
U.S. Cl.
CPC ...
H01L 2/3053 ; H01L 2/312 ; H01L 2/314 ;
Abstract
A substrate for a resin-encapsulated semiconductor device comprises a first region for mounting a plurality of semiconductor chips in which a plurality of patterned wirings, a plurality of first through holes for external connection and lands which cover the entire openings of the first through holes and partially constitute the patterned wirings are formed and a second region in which the semiconductor chips are not mounted, the first and second regions being formed on the same surface, wherein the second region is provided with a plurality of second through holes whose openings are entirely covered with a conductive film.