The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2003
Filed:
Mar. 27, 2002
Maraki Maetani, Kyoto, JP;
Kyocera Corporation, Kyoto, JP;
Abstract
A high frequency semiconductor device housing package comprises a dielectric substrate, an internal signal wiring conductor, an interlayer grounding conductor layer, a signal wiring conductor, a ball-shaped signal terminal mounting pad, and a grounding conductor layer. In the interlayer grounding conductor layer opposed to the signal wiring conductor is provided a conductive layer non-forming portion so as to be located in a region directly above the ball-shaped signal terminal mounting pad. An effective distance from the ball-shaped signal terminal mounting pad to the interlayer grounding conductor layer is made greater than an effective distance from the ball-shaped signal terminal mounting pad to the grounding conductor layer. With this configuration, the parasitic capacitance at the pad is reduced and a high frequency signal is efficiently transmitted.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile