The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2003
Filed:
Jul. 25, 2001
Michihiko Ichinose, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A semiconductor device includes an interposing substrate having a top surface mounting thereon a semiconductor chip and a bottom surface mounting thereon a solder ball islands. Chip electrodes of the semiconductor chip are connected to the solder ball islands through a top interconnect pattern, via holes and a bottom interconnect pattern. The second interconnect pattern has a solder-flow damping/stopping pattern in the vicinity of the solder ball islands for stopping the solder from flowing onto the bottom interconnect pattern upon melting.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile