The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2003
Filed:
Aug. 27, 1998
Applicant:
Inventors:
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/3544 ; H01L 2/906 ; H01L 2/358 ; H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/3544 ; H01L 2/906 ; H01L 2/358 ; H01L 2/348 ;
Abstract
A semiconductor substrate has an element formation region and a scribe line region surrounding the element formation region. A metal wiring layer is formed so as to cover end portions of a plurality of interlayer insulating films over the entire periphery of the element formation region and includes cut portions at the corner of the element formation region. Then, a SOG film is formed on the entire surface of the substrate by spin coating, at that time, material of the SOG film flows out through the cut portion toward the scribe line region to prevent a SOG puddle from forming at the corner of the element formation region.