The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2003
Filed:
Sep. 16, 1999
Kazuo Ouchi, Osaka, JP;
Kazunori Mune, Osaka, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
Circuit patterns are formed on the one surface of an insulating substrate, and an insulating layer is formed to cover the circuit patterns. The insulating layer is made of a photosensitive and thermally-melting type adhesive resin. In the insulating layer, through-holes are made by exposure/development processing to form conductive paths for contacts and contact portions. On the other surface of the insulating substrate, a conductive layer is formed and openings each passing through the conductive layer and insulating substrate are formed. Thus, a mounting substrate can be obtained which has a structure in which first circuit patterns each is exposed in each of the openings. A chip is mounted on the mounting substrate thus formed and heated. The insulating layer serves as an adhesive to seal the active face of the chip.