The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6538147 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 25, 2003

Filed:

Jan. 25, 2001
Applicant:
Inventor:

Hyungsoo Choi, Champaign, IL (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C07F 1/08 ; C23C 1/618 ;
U.S. Cl.
CPC ...
C07F 1/08 ; C23C 1/618 ;
Abstract

The present invention provides a copper precursor according to the formula (R COOCR COR )Cu {L} , where x is 1, 2 or 3 and L is a neutral ligand. The precursors in the present invention, which are low melting solids or distillable liquids with high volatility and thermal stability, can be vaporized without decomposition and used to deposit high quality copper films. The improved stability of the copper compounds in the present invention enables them to reproducibly produce selective copper films on metallic or electrically conductive surfaces.


Find Patent Forward Citations

Choi, Hyungsoo. (2003). Organocopper precursors for chemical vapor deposition (U.S. Patent No. 6538147). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6538147

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