The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2003
Filed:
Dec. 11, 2001
Takahiro Kitahara, Settsu, JP;
Kozo Asano, Settsu, JP;
Kazuo Ishiwari, Settsu, JP;
Yoshihide Higashihata, Settsu, JP;
Tatsuya Higuchi, Settsu, JP;
Daikin Industries, Ltd., Osaka, JP;
Abstract
A tetrafluoroethylene copolymer comprising 30 to 81 mole % of tetrafluoroethylene and a 70 to 19 mole % of at least one other monomer, and having terminal carbonate groups at polymer chain ends, which has a melt flow rate of 0.1 to 100 g/10 min. at 200° C. under a load of 5 kg, and a melting point of 90 to 200° C., a laminate comprising a layer of the above tetrafluoroethylene copolymer, and a layer of other material, and a surface film or a transparent filler material for a solar cell, which comprises the above tetrafluoroethylene copolymer is disclosed. The fluororesin can be firmly adhered directly to other materials such as resins, metals, glass, crystalline silicon, polycrystalline silicon and amorphous silicon, while maintaining characteristics such as chemical resistance, solvent resistance, non-tackiness, electrical insulation properties, stain-proofing properties and flame retardance. The fluororesin can also be molded at a lower temperature than conventional fluororesins, and thus can be heat bonded or co-extruded with general purpose resins having low heat resistance.