The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2003
Filed:
Jun. 11, 2001
Stephen A. Stockman, Morgan Hill, CA (US);
Limileds Lighting, U.S., LLC, San Jose, CA (US);
Abstract
To allow hydrogen to out-diffuse from a buried Group III-nitride compound semiconductor p-type layer, the wafer is etched to form trenches in the p-type layer to expose sides of the p-type layer. After the etch, the wafer is then annealed. The duration and temperature of the anneal depend upon the spacing of the exposed sides of the p-type layer and the thickness of the p-type layer. The hydrogen diffuses easily through the p-type layer and out the sides exposed by the trenches. The result is a buried p-type layer that is more highly conductive than had the trenches not been formed prior to the anneal. In another embodiment, a surface of an acceptor-doped Group III-V p-type layer is covered with an overlying n-type layer. A portion of the n-type layer is etched to expose the surface of the p-type layer. An anneal is then carried out to out-diffuse hydrogen from the exposed surface of the p-type layer to increase the conductivity of the p-type layer.