The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6537826 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 25, 2003

Filed:

Feb. 06, 2001
Applicant:
Inventor:

Akira Horigane, Tsukuba-Shi, Ibaraki 305-0035, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 1/42 ;
U.S. Cl.
CPC ...
G01N 1/42 ;
Abstract

An apparatus and a process for preparing a material, such as a sample, for analysis, observation, recording or the like, at a high accuracy, by a simple construction and simple operation, which can form a cut face and/or a cut rift while preventing deformation, destruction and denaturing of the material. The process involves embedding a part of the material ( ) in a filler ( ) in a holder ( ) of a holding unit ( ) under settling with a settling means ( ), holding the protruding portion ( ) of the material ( ) by a protruding portion support ( ) of a mount ( ), freezing the material ( ) instantaneously by dry ice placed in dry ice wells ( ) while effecting a gas phase replacement and cutting the material ( ) by a cutter ( ) to form a cut face ( ) and/or a cut rift ( ).


Find Patent Forward Citations

Horigane, Akira. (2003). Process for material preparation, apparatus therefor and method for analysis (U.S. Patent No. 6537826). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6537826

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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