The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 2003

Filed:

Nov. 26, 2001
Applicant:
Inventors:

Urs-Detlev Schoop, Westborough, MA (US);

Suresh Annavarapu, Brookline, MA (US);

Martin W. Rupich, Framingham, MA (US);

Xiaoping Li, Westborough, MA (US);

Wei Zhang, Shrewsbury, MA (US);

Edward J. Siegal, Malden, MA (US);

Qi Li, Marlborough, MA (US);

Assignee:

American Superconductor Corporation, Westborough, MA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09K 1/900 ;
U.S. Cl.
CPC ...
C09K 1/900 ;
Abstract

The invention relates to multi-layer articles and methods of making such articles. The multi-layer superconductors can have one or more layers with an oriented termination plane. The methods include first conditioning the termination plane of an underlying layer, such as a buffer layer or a superconductor layer, then disposing a layer of material on the conditioned termination plane. The conditioned termination plane can be a high quality termination plane. Superconductor articles formed by these methods can exhibit relatively high critical current densities.


Find Patent Forward Citations

Schoop, Urs-Detlev. (2003). Multi-layer superconductor having buffer layer with oriented termination plane (U.S. Patent No. 6537689). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6537689

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…