The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 18, 2003

Filed:

May. 31, 2001
Applicant:
Inventors:

William Clark, Palm Bay, FL (US);

Douglas Heckaman, Indialantic, FL (US);

Edward Bajgrowicz, Palm Bay, FL (US);

Assignee:

Harris Corporation, Melbourne, FL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/04 ; H01P 1/04 ;
U.S. Cl.
CPC ...
H05K 7/04 ; H01P 1/04 ;
Abstract

An interconnect structure interconnects electronic modules and includes a backplane assembly formed from a substantially rigid backplane plate that carries RF connectors and a digital motherboard having digital connectors for mating with digital connectors of electronic modules. A controlled impedance interconnect circuit is positioned on the rear surface of the backplane plate and interconnects the RF connectors carried by the backplane plate and digital connectors of the digital motherboard. A rack receives the backplane assembly and supports a plurality of electronic modules that are interconnected to each other via the backplane assembly.


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